| Item |
Flex PCB |
Rigid-Flex PCB |
Remarks & Test Method |
| Layers |
1~12 |
2-12 |
|
| Width/Space(mini) |
Single-sided |
0.075mm(3mil) |
¡¡ |
| Double-sided |
0.075mm(3mil) |
| Hole(mini) |
Drill(pth) |
0.15mm |
¡¡ |
| Punching |
0.50mm |
| Dimension tolerance |
Line width |
¡À0.03mm |
W¡Ü0.15mm |
| Hole |
¡À0.05mm |
H¡Ü1.5mm |
| Accumulative tolerance |
¡À0.05mm |
P¡Ü10mm |
| Outline |
¡À0.10mm |
Special ¡À0.07mm |
Conductor to
outline |
¡À0.10mm |
Special ¡À0.075mm |
| Surface
treatment |
Ni/Au Plating |
Ni: 2-8um (80u"-320u") |
¡¡ |
| Au: 0.03-0.15um(1.2u"-6u") |
Electronic Nickel
Immersion Gold
(ENIG) |
Ni: 2-6um(80u"-240u") |
Au¡Ý0.05um(2u")
or specified by customer |
| Tin Plating |
10-20um
or Specified by customer |
| Peel Strength |
Adhesive: 1.0mil |
1.0kg f/cm |
1.0kg f/cm |
IPC-TM-650 2.4.9 |
| Adhesive: 0.5mil |
0.5kg f/cm |
0.5kg f/cm |
| Solder float Resistance |
270¡æ/10sec |
270¡æ/10sec |
IPC-TM-650 2.4.13 |
| Insulation Resistance |
500M¦¸ |
500M¦¸ |
IPC-TM-650 2.6.3.2 |
| Dielectric withstanding voltage |
500V |
500V |
IPC-TM-650 2.5.7 |
| Chemical Resistance |
No discoloration |
No discoloration |
IPC-TM-650 2.3.2 |
| Thermal
shock |
The resistance value
shall not vary
by more than ¡À10% |
The resistance value
shall not vary
by more than ¡À10% |
IPC-TM-650 2.6.7.2B |
| SMT Service & Capability |
SMT services available on specified conditions,
connector pitch(mini):0.4mm
Chip size(mini): 0201 |
Product & Technology - Capabilities - Flex PCB, Rigid-Flex PCB