Integrated Services

Assembly Capabilities
3C Product Mother Board
PQFP, BGA(Package)
Finest IC pitch-0.4mm
Max BGA Tin Ball-544 Balls
Max. QFP pin-208pin
PCBsize-50*30*0.4~410*360*0.4(mm)
Chip Mounting-1.0*0.5(0402)~55*55(mm)
Max Speed-0.075 sec/chip
Double Side Assembly

Process and quality control flow chart

Quality assurance system

Quality Assurance Standard

IPC-610B specification
AQL MIL-STD-105E Level II
IQC lot AQL: 0.65% major defect, 1.5% minor defect
PQC lot AQL: SMT : 0.65%, 2nd Operation : 1.0%
QC test sampling: 10%, 100% functionality tested products
OQC lot AQL: 0.65% major defect, 1.5% minor defect

Quality Assurance Practice

Quality Concept: Six-sigma (6-s)
Major practices:
Total Process Control
Total Quality Management
Statistical Process Control
Process Action Team
Quality Tracking System

Critical Quality Test

3D Test Equipment
X-RAY Test Equipment
Environment Test Equipment( Including High Temperature & Humidity、Low Temperature & Humidity、Temperature & Humidity Cycle Test)

*Information needed for an assembly inquiry. Gerber files for bare board, detailed BOM list, Testing procedures, Schematics and Theory of Operations and samples if available